Announcements
4-Watt Thin Film for High Power Applications
- Posted: 21 August, 2019
Sarcon® 30YR-c from Fujipoly® is a compliant silicone thin film that is ideal for filling near-microscopic air gaps that exist between high-power heat generating components and heatsinks.
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Gel-Like Gap Filler Improves Cooling Performance
- Posted: 25 July, 2019
Sarcon® GR-Ae is an extremely versatile, gel-like consistency thermal interface material that can be die cut to fit almost any shape electronic component.
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Ultra-Compressible Thermal Putty
- Posted: 14 May, 2019
Sarcon® PG80A is an extremely compressible, high-performance thermal interface material. This advanced putty-like, gap filler pad exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13 W/m°K.
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Fujipoly's Coolest Giveaway 2019
- Posted: 18 April, 2019
Just click a link & name a Fujipoly® product and you could be the winner of the 2019 Stay Cool and Get Connected Giveaway.
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Ultra Soft and Extremely Affordable Thermal Gap Filler
- Posted: 27 March, 2019
Sarcon® PG25A is one of Fujipoly's softest, most compressible and affordable thermal gap filler materials. It offers gel like consistency in a convenient sheet form.
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Engineered Silicone Extrusions
- Posted: 8 February, 2019
Fujipoly® is a world leader in the design and custom manufacturing of silicone rubber extruded gaskets.
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February 26th Webinar - Advantages of Using Putty Type Gap Fillers
- Posted: 11 January, 2019
On February 26 we invite you to join us for a live webinar and learn more about Fujipoly® Putty-Type Gap Filler materials. Registration opens January 28th - Learn More
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High Performance Thin Film
- Posted: 22 November, 2018
Fujipoly® offers a high-performance thin film that delivers a thermal conductivity of 2.2 W/m•K with a thermal resistance as low as .33°C•in2/W.
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Molded Sarcon® TIM Cases
- Posted: 25 October, 2018
Fujipoly® offers an assortment of standard as well as custom size molded Sarcon® Cases. The thermally conductive, box-shaped components are open on one end to facilitate fast and easy installation over transistors and other heat generating components.
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