Announcements
New! Extremely Low Compression Force Thermal Putty
- Posted: 24 May, 2021
SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low
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Fujipoly's Coolest Giveaway Ever
- Posted: 19 April, 2021
Just click a link & name a Fujipoly® product and you could be the winner of the 2021 Stay Cool and Get Connected Giveaway.
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New Low Stress 2-Part TIM
- Posted: 26 March, 2021
Fujipoly® introduces SARCON® LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.
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New 8.0-Watt Thermal Putty
- Posted: 17 February, 2021
Fujipoly® announces the introduction of SARCON® PG80B, its newest high-performance putty-like thermal interface material.
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Fujipoly® Achieves IATF 16949:2016 Certification
- Posted: 12 January, 2021
Fujipoly America Corp., a world leader in the production of thermal interface materials and elastomeric connectors, announces that it has achieved IATF 16949:2016 certification.
Read MoreNew! Extremely Low Compression Force Thermal Putty
- Posted: 17 November, 2020
SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low
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New 2-Part Thermal Gap Fillers
- Posted: 20 October, 2020
Fujipoly® introduces a new line of two-component thermal gap fillers that also exhibit excellent electrical insulative properties.
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Setting the Standard for TIMs
- Posted: 17 September, 2020
To accommodate diverse thermal cooling requirements, Fujipoly® offers (4) formulations of Standard Performance Gap Filler Pads.
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Tube-Shaped TIMs are a Perfect Fit for Transistors
- Posted: 26 August, 2020
Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process.
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New Sarcon® Sample Kit
- Posted: 17 July, 2020
Fujipoly® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon® Thermal Interface Materials.
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