Latest White Papers and Webinars
Challenges and Solution for Pick and Place Automation of
Thermal Gap Filler Pads
Automation in electronics manufacturing is nothing new, but today many thermal gap filler pads are still placed by hand. With an increasing demand for automation the need to incorporate gap filler pad installation into automated processes is growing. In this webinar we will discuss what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.
Selecting the Right Thermal Interface Material for your Application
This webinar by Fujipoly covers the many variables and considerations involved when selecting an appropriate Thermal Interface Material solution for your applications. We will discuss the different material options available, and which types of applications each is best suited for. The presentation will address some of the common challenges of thermal applications such as compression force limitations, dielectric concerns, and handling challenges.
ZEBRA® Elastomeric Connectors: Connecting You To the World
ZEBRA® Elastomeric Connectors are high-performance interconnect devices with applications throughout the entire field of electronics. With the expansion of micro-electronics and miniaturization of all products, the same high reliability must be maintained.
In this webinar from Fujipoly, learn more about:
-
High Density; increased number of I/O’s
-
Low resistance, high current capacity
-
Low insertion force, low compression force
-
Redundant contact engagement
-
High electrical and mechanical reliability
-
Chemical stability, degradation resistance
-
Cost-effectiveness, ease of assembly
This on-demand webinar discusses how these connectors offer a variety of alternatives and options based on primary design objectives.