SPG-20B

Sarcon® SPG-20B is highly conformable/thermally conductive, low viscosity and easier dispensable type silicone compound. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. Sarcon® SPG-20B easily forms and adheres to most of surfaces, shapes, and sizes of components.

Sarcon® SPG-20B makes complete and reliable physical contact with the component and opposing surfaces. It provides handling properties that are superior to thermal grease & potting materials.

FEATURES:

• Suitable for filling the delicate gaps and still provide superior thermal transfer.
• Highly conformable with very low compression forces.
• Has excellent vibration absorption capabilities.
• Maintains thermal properties across a wide temperature range.
• Can be used to "Form-In-Place" and will remain form stable.
• Requires no heat curing.
• Will not cause corrosion on any metal surface.

SPECIFICATIONS:

PRODUCT CONSTRUCTION:

RELIABILITY:

Thermal resistance under heat, cold, humid and thermal shock conditions.

^{Unit of Thermal Resistance: ?C•in2/W based on ASTM D5470 Test Method.
Contact Surface: 3.14cm2 (0.49in2)
Filled material’s weight: .45g for 0.5mm gap}