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Form In Place Gap Filler
Features
Highly Thermally Conductive and Electricity Insulative Silicone Compound
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Fill large gaps while providing superior thermal transfer
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Comfortable with the very low compression forces
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Excellent vibration absorption capabilities
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Maintains all initial properties across a wide range
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Used to "Form in Place" and remain form stable
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Requires no heat curing
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Will not cause corrosion on any metal surface
Gap Filler Product Filter
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You Selected:
SPG-20B
Product Image | Product Name | Thermal Conductivty (W/m-K) | Construction | Color | TDS Download |
|---|---|---|---|---|---|
SPG-20B | 2.1 | Silicone Type | Light Gray | TDS Download | |
SPG-30B | 3.1 | Silicone Type | Apricot | TDS Download | |
SPG-50A | 5 | Silicone Type | Light Sky Blue | TDS Download | |
SPG-70A | 7 | Silicone Type | Sky Blue | TDS Download |
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FAQs
Frequently asked questions
Form in Place
Putty
Electromagnetic Wave
Standard & High Perform
Thin Film
Non-Silicone
General
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