EM Noise Suppression Sheet
Features
Silicone Gap Filler Pad for Suppression of Electromagnetic Wave
-
Effective to absorb and damp a wide range of electromagnetic waves and also effective as a high performance thermal interface material
-
Easily filling in small gaps of IC chip surface with a soft gel texture
-
Good workability to simply insert the product between the circuit board and casing
-
Self-adhesive gel surface does not require any adhesive tape for assembly
-
EGR-11F: Extremely low level of low molecular siloxane
EGR-11F-0H
Tacky Both Sides (Plain Type) Hardened
Surface
Silicone compound as above EGR-11F-00 plus additional hardening of the top surface to facilitate handling and installation during complex assemblies.
Thermal Conductivity (W/m-K):
0.5
Available in homogenous thickness starting at (mm):
For thicker options contact us.
1
Find Your Gap Filler Pad
You Selected:
100EG-11F-0H-11F
Product Image | Product Name | Thermal Conductivty (W/m-K) | Construction | Thickness (mm) | Color | TDS Download |
|---|---|---|---|---|---|---|
100EG-11F-0H-11F | 1 | Tacky Both Sides (Plain Type)Hardened
Surface | 1 | Dark Gray | TDS Download | |
150EG-11F-00 | 1 | Tacky Both Sides (Plain Type) | 1.5 | Dark Gray | TDS Download | |
50EG-11F-0H-11F | 1 | Tacky Both Sides (Plain Type)Hardened
Surface | 0.5 | Dark Gray | TDS Download | |
EGR30A-0H-50GY | 3 | Hardened Surface | 0.5 | Dark Gray | TDS Download | |
EGR30A-0H-150GY | 3 | Hardened Surface | 1.5 | Dark Gray | TDS Download | |
EGR30A-0H-100GY | 3 | Hardened Surface | 1 | Dark Gray | TDS Download | |
EGR30A-0H-250GY | 3 | Hardened Surface | 2.5 | Dark Gray | TDS Download | |
EGR30A-0H-200GY | 3 | Hardened Surface | 2 | Dark Gray | TDS Download |