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Non-Silicone Form in Place
Features
Highly Thermally Conductive and Electrically Insulative Silicone Free Compound
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Suitable for filling delicate gaps and still providing superior thermal transfer
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Highly comfortable with very low compression forces
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Has excellent vibration absorption capabilities
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Maintains thermal properties across a wide temperature range
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Can be used to "Form in Place" and will remain form stable
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Requires no heat curing
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Will not cause corrosion on any metal surface
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Silicone free
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SPG-25B-NS
Product Image | Product Name | Thermal Conductivty (W/m-K) | Construction | Thickness (mm) | Color | TDS Download |
|---|---|---|---|---|---|---|
SPG-25B-NS | 2.5 | Non-Silicone Type | White | TDS Download |
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FAQs
Frequently asked questions
Non-Silicone
General
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