Announcements

Reinforced Thermal Interface Thin Film

Posted: 24 January, 2018

Sarcon® 20GAR from Fujipoly® is a high-performance, glass fabric reinforced thermal interface material that is perfect for complex die-cut shapes.

New Gap Filler Transfers Heat and Absorbs Electromagnetic Waves

Posted: 24 January, 2018

Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon® EGR-11F makes it easy to handle and apply without requiring additional adhesive.

Easy to Apply Form-in-Place Thermal Gap Filler

Posted: 24 January, 2018

SARCON® SPG-20A from Fujipoly® is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0 W/m°K and a thermal resistance of only 2.1°K•cm2/W.

Extremely Soft TIM Delivers Low Thermal Resistance

Posted: 24 January, 2018

Sarcon® PG25A is one of Fujipoly's softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates.When it is sandwiched between components of varying shapes and sizes and a nearby heat sink or

Fujipoly Announces Winner

Posted: 24 January, 2018

Fujipoly® is pleased to announce that Rick Rudman from Bose Corporation in Framingham, MA is this year’s Stay Cool and Get Connected Giveaway winner.He selected a $500.00 American Express Gift Card from 3 great giveaways that included a Nikon Camera and

Extremely Soft TIM Delivers 13 W/m°K Performance

Posted: 25 May, 2017

Sarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads. The 13 W/m°K putty-like material requires very low compression force at high compression rates, allowing it to gently conform to most

Fujipoly’s Coolest Giveaway

Posted: 11 April, 2017

Just click a link & name a Fujipoly® product and you could be the winner of the 2017 Stay Cool and Get Connected Giveaway.

Form-in-Place TIM Fills Large Gap

Posted: 27 March, 2017

SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm.

A Better Connection

Posted: 23 February, 2017

The Zebra® 1002 Carbon Connector from Fujipoly® offers electronic device manufacturers an extremely affordable and reliable option for connecting printed circuit boards to a variety of LCD displays.The unique layered construction of this interconnect

New Benchmark for Thin Film Performance

Posted: 20 January, 2017

Fujipoly’s SARCON® 30XR-Um Thin Film sets a new standard for performance and compressibility.

Engineers in Action

Announcements