Announcements

New Silicone Free Form-in-Place Thermal Gap Filler

Posted: 22 July, 2021

SARCON® SPG-25B-NS from Fujipoly® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of only 2.1°K•cm2/W.

Cost-Sensitive Thermal Interface Material

Posted: 24 June, 2021

Sarcon® GR14B from Fujipoly® is a low oil bleed/low specific gravity gap filler pad material that is offered in

New! Extremely Low Compression Force Thermal Putty

Posted: 24 May, 2021

SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low

Fujipoly's Coolest Giveaway Ever

Posted: 19 April, 2021

Just click a link & name a Fujipoly® product and you could be the winner of the 2021 Stay Cool and Get Connected Giveaway.

New Low Stress 2-Part TIM

Posted: 26 March, 2021

Fujipoly® introduces SARCON® LG30A, a 2-component form-in-place thermal gap filler that delivers a thermal conductivity of 3.0 W/m°K.

New 8.0-Watt Thermal Putty

Posted: 17 February, 2021

Fujipoly® announces the introduction of SARCON® PG80B, its newest high-performance putty-like thermal interface material.

Fujipoly® Achieves IATF 16949:2016 Certification

Posted: 12 January, 2021

Fujipoly America Corp., a world leader in the production of thermal interface materials and elastomeric connectors, announces that it has achieved IATF 16949:2016 certification.