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Engineers In Action


Fujipoly® Thermal Interface Material Application in car Infotainment systems.

How to use Fujipoly® Thermal Interface Materials in car Infotainment system applications.

Fujipoly® Thermal Interface Material Application in car chargers.

How to use Fujipoly® Thermal Interface Materials in car charger applications.

Fujipoly® Thermal Interface Material Application in cameras.

How to use Fujipoly® Thermal Interface Materials in camera applications.

Fujipoly® Thermal Interface Material Application in Data Centers.

How to use Fujipoly® Thermal Interface Materials in Data Center applications.

Fujipoly® Thermal Interface Material Application in Base Stations.

How to use Fujipoly® Thermal Interface Materials in Base Station applications.

Fujipoly® Thermal Interface Material Application in Automotives.

How to use Fujipoly® Thermal Interface Materials in Automotive applications.

Fujipoly® Thermal Interface Material Application in Optical Transceivers.

How to use Fujipoly® Thermal Interface Materials in a Optical Transceiver application.

Fujipoly® Thermal Interface Material Application in Power Control Units.

How to use Fujipoly® Thermal Interface Materials in a Power Control Unit application.

Fujipoly® Thermal Interface Material Application in Millimeter-Wave Radar.

How to use Fujipoly® Thermal Interface Materials in a Millimeter-Wave Radar application.

Fujipoly® Thermal Interface Material Application in Lights.

How to use Fujipoly® Thermal Interface Materials in a light application.

Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress

Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB.

Advantages of Putty Type Gap Fillers Webinar - February 26, 2019

The need for low compression force Thermal Gap Fillers continues to become more prevalent. Tolerance variations drive the need for compliant Thermal Gap Filler Materials. To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials. Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers

Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials

Thermal Live 2018 Webinar presented by Applications Engineer Christian Miraglia

Fujipoly In Depth Understating of Compression Characteristics

Thermal Live 2017 Webinar presented by Applications Engineer Christian Miraglia

Thermal Interface Material Compression Testing

Demonstration of Thermal Interface Material compression testing at Fujipoly's Customer Engineering Resource Center (CERC) in San Jose, California.

Fujipoly Customer Engineering Resource Center, San Jose CA

At our Customer Engineering Resource Center in San Jose, California we can evaluate and test Fujipoly products to see how they will perform for your specific application. We are fully equipped to test Thermal Resistance, Electrical Resistance/Isolation, Compression Force, Hardness, Viscosity, Tensile Strength, Reliability Testing at High & Low temperatures and heat shock. We stock a large selection of Fujipoly thermal interface materials and even have a plotter cutter to produce no-tooling samples while you wait!

Fujipoly Thermal Interface Material Gap Filler Selection

How to select the optimal gap filler thermal interface material.

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