Upcoming Webinars
Upcoming Webinars
TBD
Past Webinars
Date: Wednesday, October 19, 2022
Time: 10:45 AM Eastern Daylight Time
Duration: 45 minutes
Introduction to Carbon Fiber-Orientated Thermal Gap Filler
Thermal gap filler conductivity has increased dramatically over the last 10 years. The ever-increasing power and smaller area have driven the need for higher conductivity thermal gap fillers. In order to increase thermal conductivity, Fujipoly has explored various thermal fillers to achieve ultra-high thermal conductivity. One of those fillers is Carbon fiber.
In this webinar, we will look at the need for higher conductivity materials and how carbon fiber-oriented thermal gap fillers can meet the demand for higher heat flux. Carbon fiber-oriented thermal gap fillers exhibit very low thermal resistance while still offering a highly compressible thermal gap filler. We will explore some of the properties of carbon fiber-oriented gap fillers as well as best practices for implementing them. We will discuss how they can be a great option when more conventional thermal gap fillers are not proving the thermal resistance or compliance needed.
Applications Engineering Manager
Fujipoly America-Customer Engineering Resource Center (CERC)
Christian is a graduate of the New Jersey Institute of Technology and has over 15 years of experience working in Thermal interface
Dispensable Thermal Interface Materials: An Overview
30-Minute Presentation and Live Question & Answer Session
This webinar will provide an overview of dispensable gap fillers and what advantages they can provide over other gap filler products. We will discuss packaging and dispensing options, and factors that impact flow rates.
Presented by: Christian Miraglia Applications Engineering Manager, Fujipoly® America Corporation
Dispensable Thermal Interface Materials: An Overview
30-Minute Presentation and Live Question & Answer Session
This webinar will provide an overview of dispensable gap fillers and what advantages they can provide over other gap filler products. We will discuss packaging and dispensing options, and factors that impact flow rates.
Presented by: Christian Miraglia Applications Engineering Manager, Fujipoly® America Corporation
ZEBRA® Elastomeric Connectors: Connecting You to the World
ZEBRA® Elastomeric Connectors are high performance interconnect devices with applications throughout the entire field of electronics. With the expansion of micro-electronics and miniaturization of all products, the same high reliability must be maintained. ZEBRA® Elastomeric Connectors offers a variety of alternatives based on the primary design objectives.
Duration: 1 hour
Click Here to Watch On Demand
THERMAL LIVE 2019 - Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
Presented by Christian Miraglia, Applications Engineering Manager
Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB.
Fujipoly February 2019 Webinar - Advantages of Putty Type Gap Fillers Webinar
Presented by Christian Mainegra, Sales Engineer
The need for low compression force Thermal Gap Fillers continues to become more prevalent. Tolerance variations drive the need for compliant Thermal Gap Filler Materials. To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials. Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers.
Key Topics Include:
- What is a Putty vs. a standard Gap Filler
- Comparisons of stress strain of Putties vs. Standard Gap Fillers
- Advantages of Putty over dispensable Gap Fillers
- Handling/Application Notes
Thermal Live 2018 Webinar - Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials
Presented by Applications Engineer Christian Miraglia
Thermal Live 2017 Webinar - Compression Characteristics of Thermal Interface Gap Fillers Materials
Presented by Applications Engineer Christian Miraglia
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