Upcoming Webinars

Join Us at THERMAL LIVE 2019
Tuesday, October 22, 2019 at 1:15 PM EST

Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
Presented by Christian Miraglia, Applications Engineering Manager

Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface.  In this webinar, we will look at the compression characteristics of thermal gap filler pads.  We will apply this understanding to a PCB assembly.  Webinar attendees will have a better understanding of what basic analytical techniques and tests can be performed to understand stress as well as defection in both gap filler pads and PCB.

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Past Webinars

Advantages of Putty Type Gap Fillers  I  Live Webinar with Q&A Session 

The need for low compression force Thermal Gap Fillers continues to become more prevalent.  Tolerance variations drive the need for compliant Thermal Gap Filler Materials.  To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials.  Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers.

Key Topics Include:

• What is a Putty vs. a standard Gap Filler
• Comparisons of stress strain of Putties vs. Standard Gap Fillers
• Advantages of Putty over dispensable Gap Fillers
• Handling/Application Notes

Presented by: 
Christian Mainegra, Sales Engineer 
Christian is a Thermal Interface Material expert and 2012 graduate of The New Jersey Institute of Technology.  He has six years’ experience as Sales Engineer at Fujipoly® America Corporation.