Upcoming Webinars
Upcoming Webinars
Wednesday, April 27th 1:00 pm EST
Dispensable Thermal Interface Materials: An Overview
30-Minute Presentation and Live Question & Answer Session
This webinar will provide an overview of dispensable gap fillers and what advantages they can provide over other gap filler products. We will discuss packaging and dispensing options, and factors that impact flow rates.
Presented by: Christian Miraglia Applications Engineering Manager, Fujipoly® America Corporation
Past Webinars
Dispensable Thermal Interface Materials: An Overview
30-Minute Presentation and Live Question & Answer Session
This webinar will provide an overview of dispensable gap fillers and what advantages they can provide over other gap filler products. We will discuss packaging and dispensing options, and factors that impact flow rates.
Presented by: Christian Miraglia Applications Engineering Manager, Fujipoly® America Corporation
ZEBRA® Elastomeric Connectors: Connecting You to the World
ZEBRA® Elastomeric Connectors are high performance interconnect devices with applications throughout the entire field of electronics. With the expansion of micro-electronics and miniaturization of all products, the same high reliability must be maintained. ZEBRA® Elastomeric Connectors offers a variety of alternatives based on the primary design objectives.
Duration: 1 hour
Click Here to Watch On Demand
THERMAL LIVE 2019 - Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
Presented by Christian Miraglia, Applications Engineering Manager
Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB.
Fujipoly February 2019 Webinar - Advantages of Putty Type Gap Fillers Webinar
Presented by Christian Mainegra, Sales Engineer
The need for low compression force Thermal Gap Fillers continues to become more prevalent. Tolerance variations drive the need for compliant Thermal Gap Filler Materials. To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials. Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers.
Key Topics Include:
- What is a Putty vs. a standard Gap Filler
- Comparisons of stress strain of Putties vs. Standard Gap Fillers
- Advantages of Putty over dispensable Gap Fillers
- Handling/Application Notes
Thermal Live 2018 Webinar - Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials
Presented by Applications Engineer Christian Miraglia
Thermal Live 2017 Webinar - Compression Characteristics of Thermal Interface Gap Fillers Materials
Presented by Applications Engineer Christian Miraglia
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