Upcoming Webinars

THERMAL LIVE 2019 - Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
Presented by Christian Miraglia, Applications Engineering Manager

Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB.

Fujipoly February 2019 Webinar - Advantages of Putty Type Gap Fillers Webinar 
Presented by Christian Mainegra, Sales Engineer 

The need for low compression force Thermal Gap Fillers continues to become more prevalent.  Tolerance variations drive the need for compliant Thermal Gap Filler Materials. To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials.  Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers.

Key Topics Include:

• What is a Putty vs. a standard Gap Filler
• Comparisons of stress strain of Putties vs. Standard Gap Fillers
• Advantages of Putty over dispensable Gap Fillers
• Handling/Application Notes

Thermal Live 2018 Webinar - Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials
Presented by Applications Engineer Christian Miraglia

Thermal Live 2017 Webinar - Compression Characteristics of Thermal Interface Gap Fillers Materials
Presented by Applications Engineer Christian Miraglia