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Upcoming Webinars

 

Upcoming Webinars

Date: Wednesday, October 19, 2022
Time: 10:45 AM Eastern Daylight Time
Duration: 45 minutes

Introduction to Carbon Fiber-Orientated Thermal Gap Filler

Thermal gap filler conductivity has increased dramatically over the last 10 years.  The ever-increasing power and smaller area have driven the need for higher conductivity thermal gap fillers.  In order to increase thermal conductivity, Fujipoly has explored various thermal fillers to achieve ultra-high thermal conductivity.  One of those fillers is Carbon fiber.

 In this webinar, we will look at the need for higher conductivity materials and how carbon fiber-oriented thermal gap fillers can meet the demand for higher heat flux.  Carbon fiber-oriented thermal gap fillers exhibit very low thermal resistance while still offering a highly compressible thermal gap filler.   We will explore some of the properties of carbon fiber-oriented gap fillers as well as best practices for implementing them. We will discuss how they can be a great option when more conventional thermal gap fillers are not proving the thermal resistance or compliance needed.

 
Christian Miraglia
Christian Miraglia
Applications Engineering Manager
Fujipoly America-Customer Engineering Resource Center (CERC)

Christian is a graduate of the New Jersey Institute of Technology and has over 15 years of experience working in Thermal interface

 REGISTER NOW!

 


 

Past Webinars

 

Dispensable Thermal Interface Materials: An Overview

30-Minute Presentation and Live Question & Answer Session 

This webinar will provide an overview of dispensable gap fillers and what advantages they can provide over other gap filler products. We will discuss packaging and dispensing options, and factors that impact flow rates. 

Presented by: Christian Miraglia Applications Engineering Manager, Fujipoly® America Corporation

Click Here to Watch On-Demand


Dispensable Thermal Interface Materials: An Overview

30-Minute Presentation and Live Question & Answer Session 

This webinar will provide an overview of dispensable gap fillers and what advantages they can provide over other gap filler products. We will discuss packaging and dispensing options, and factors that impact flow rates. 

Presented by: Christian Miraglia Applications Engineering Manager, Fujipoly® America Corporation

 Click Here to Watch On-Demand

 


 

ZEBRA® Elastomeric Connectors: Connecting You to the World

ZEBRA® Elastomeric Connectors are high performance interconnect devices with applications throughout the entire field of electronics. With the expansion of micro-electronics and miniaturization of all products, the same high reliability must be maintained. ZEBRA® Elastomeric Connectors offers a variety of alternatives based on the primary design objectives.

 Duration: 1 hour

Click Here to Watch On Demand

 


 

 

THERMAL LIVE 2019 - Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
Presented by Christian Miraglia, Applications Engineering Manager

Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB.


Fujipoly February 2019 Webinar - Advantages of Putty Type Gap Fillers Webinar 
Presented by Christian Mainegra, Sales Engineer 

The need for low compression force Thermal Gap Fillers continues to become more prevalent.  Tolerance variations drive the need for compliant Thermal Gap Filler Materials. To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials.  Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers.

Key Topics Include:

  • What is a Putty vs. a standard Gap Filler
  • Comparisons of stress strain of Putties vs. Standard Gap Fillers
  • Advantages of Putty over dispensable Gap Fillers
  • Handling/Application Notes

Thermal Live 2018 Webinar - Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials
Presented by Applications Engineer Christian Miraglia


Thermal Live 2017 Webinar - Compression Characteristics of Thermal Interface Gap Fillers Materials
Presented by Applications Engineer Christian Miraglia


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