Announcements
New 8.0-Watt Thermal Putty
- Posted: 17 February, 2021
Fujipoly® announces the introduction of SARCON® PG80B, its newest high-performance putty-like thermal interface material.
Read MoreFujipoly® Achieves IATF 16949:2016 Certification
- Posted: 12 January, 2021
Fujipoly America Corp., a world leader in the production of thermal interface materials and elastomeric connectors, announces that it has achieved IATF 16949:2016 certification.
Read MoreNew! Extremely Low Compression Force Thermal Putty
- Posted: 17 November, 2020
SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low
Read MoreNew 2-Part Thermal Gap Fillers
- Posted: 20 October, 2020
Fujipoly® introduces a new line of two-component thermal gap fillers that also exhibit excellent electrical insulative properties.
Read MoreSetting the Standard for TIMs
- Posted: 17 September, 2020
To accommodate diverse thermal cooling requirements, Fujipoly® offers (4) formulations of Standard Performance Gap Filler Pads.
Read MoreTube-Shaped TIMs are a Perfect Fit for Transistors
- Posted: 26 August, 2020
Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process.
Read MoreNew Sarcon® Sample Kit
- Posted: 17 July, 2020
Fujipoly® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon® Thermal Interface Materials.
Read MoreAnd the Winner Is…
- Posted: 25 June, 2020
Over the last several weeks, hundreds of engineers and industry professionals entered Fujipoly’s Great Gift Giveaway by filling out an online entry form that asked participants to simply name one of the Company’s products.
Read MoreNew 13-Watt Thermal Gap Filler
- Posted: 27 May, 2020
Fujipoly® recently released Sarcon® GR130A, its newest high-performance, thermal gap filler pad.
Read MoreNew 4.5-Watt Thermal Putty
- Posted: 27 April, 2020
Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material.
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