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Announcements

High Thermal Conductivity Thin Film

High Thermal Conductivity Thin Film

  • Posted: 19 March, 2014

If you are looking for a high performance, thermal interface solution, Fujipoly recommends you consider the company’s new Sarcon® 30-YR-a Thin Film.

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Carbon Zebra® Connector has 500 Contact Points/Inch

Carbon Zebra® Connector has 500 Contact Points/Inch

  • Posted: 21 February, 2014

Fujipoly’s  2005 Zebra® Connector is constructed from alternating layers of conductive carbon and non-conductive silicone that are as thin as 0.0004” (0.010mm).

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Fujipoly Catalog Features  New Thermal Interface Materials

Fujipoly Catalog Features New Thermal Interface Materials

  • Posted: 5 February, 2014

Fujipoly announces a February 3rd release date for its new Thermal Interface Material and Elastomeric Connector product catalog.  The 52-page product overview and technical guide includes helpful design guidelines as well as detailed thermal performance and electrical

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A New Thermal Interface Alternative

A New Thermal Interface Alternative

  • Posted: 25 November, 2013

Fujipoly’s Sarcon® 25GR-T2d thermal interface material is a very soft, highly conformable gap filler pad with a reinforced mesh center.

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Thermal Compound Sets New Industry Benchmark

Thermal Compound Sets New Industry Benchmark

  • Posted: 24 October, 2013

Fujipoly’s new SARCON SPG-50A sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 W/m°K.

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New Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W

New Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W

  • Posted: 27 September, 2013

Fujipoly’s New Sarcon GR25A-0H2-30GY is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. This special treatment dramatically reduces material tearing and damage during assembly and rework operations.

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New Low Resistance TIM Delivers 6.0 W/m°K Performance

New Low Resistance TIM Delivers 6.0 W/m°K Performance

  • Posted: 26 August, 2013

Fujipoly announces the introduction of Sarcon® GR45A-00 a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure.

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A Cooling Influence on LED Lighting

A Cooling Influence on LED Lighting

  • Posted: 24 July, 2013

Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality.

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We Have a Winner!

We Have a Winner!

  • Posted: 19 June, 2013

Over the last several weeks, hundreds of engineers and industry professionals entered Fujipoly’s Great Gift Giveaway by filling out an online entry form that asked participants to simply name one of the Company’s products.

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New Gap Filler Pad Introduced

New Gap Filler Pad Introduced

  • Posted: 24 May, 2013

Fujipoly announces the introduction of Sarcon® GR25A-00-50GY, an extremely soft thermal gap filler pad that also exhibits a very low thermal resistance.

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