Announcements
NEW Sarcon® SPG-20B Delivers Lower Thermal Resistance and Higher Thermal Conductivity
- Posted: 16 September, 2014
Fujipoly introduces a new version of its popular SARCON® SPG-15A, form-in-place thermal interface compound.
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LGA Connectors Help Reduce Assembly Costs
- Posted: 27 August, 2014
Fujipoly’s W-Series Matrix Connectors can reduce assembly time and cost for many land grid array (LGA) applications.
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Highly Conformable TIM
- Posted: 28 July, 2014
Fujipoly’s announces the expansion of its Sarcon® XR-Pe product offering with the availability of a 1.0 mm thick sheet. Sarcon® XR-Pe delivers a remarkable thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.
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And the Winner Is…
- Posted: 20 June, 2014
Over the last several weeks, hundreds of engineers and industry professionals entered Fujipoly’s Great Gift Giveaway by filling out an online entry form that asked participants to simply name one of the Company’s products.
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2014 Giveaway
- Posted: 16 April, 2014
On June 6th one lucky engineer will have the option of selecting a free Nikon D3200 Camera, Sony PS4 or $500 American Express gift card by simply naming one Fujipoly thermal interface material or elastomeric connector product! Due to the limited promotion of
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High Thermal Conductivity Thin Film
- Posted: 19 March, 2014
If you are looking for a high performance, thermal interface solution, Fujipoly recommends you consider the company’s new Sarcon® 30-YR-a Thin Film.
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Carbon Zebra® Connector has 500 Contact Points/Inch
- Posted: 21 February, 2014
Fujipoly’s 2005 Zebra® Connector is constructed from alternating layers of conductive carbon and non-conductive silicone that are as thin as 0.0004” (0.010mm).
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Fujipoly Catalog Features New Thermal Interface Materials
- Posted: 5 February, 2014
Fujipoly announces a February 3rd release date for its new Thermal Interface Material and Elastomeric Connector product catalog. The 52-page product overview and technical guide includes helpful design guidelines as well as detailed thermal performance and electrical
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A New Thermal Interface Alternative
- Posted: 25 November, 2013
Fujipoly’s Sarcon® 25GR-T2d thermal interface material is a very soft, highly conformable gap filler pad with a reinforced mesh center.
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Thermal Compound Sets New Industry Benchmark
- Posted: 24 October, 2013
Fujipoly’s new SARCON SPG-50A sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 W/m°K.
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