Announcements
New Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W
- Posted: 27 September, 2013
Fujipoly’s New Sarcon GR25A-0H2-30GY is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. This special treatment dramatically reduces material tearing and damage during assembly and rework operations.
Read MoreNew Low Resistance TIM Delivers 6.0 W/m°K Performance
- Posted: 26 August, 2013
Fujipoly announces the introduction of Sarcon® GR45A-00 a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure.
Read MoreA Cooling Influence on LED Lighting
- Posted: 24 July, 2013
Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality.
Read MoreWe Have a Winner!
- Posted: 19 June, 2013
Over the last several weeks, hundreds of engineers and industry professionals entered Fujipoly’s Great Gift Giveaway by filling out an online entry form that asked participants to simply name one of the Company’s products.
Read MoreNew Gap Filler Pad Introduced
- Posted: 24 May, 2013
Fujipoly announces the introduction of Sarcon® GR25A-00-50GY, an extremely soft thermal gap filler pad that also exhibits a very low thermal resistance.
Read MoreAmazing Gift Giveaway
- Posted: 19 April, 2013
On June 7th one lucky engineer will have the option of selecting a free iPad with Retina Display, iPad mini or $500 American Express gift card by simply naming one Fujipoly thermal interface material or elastomeric connector product! Due to the limited promotion of this
Read MoreLow Resistance Gold Plated Connector
- Posted: 28 March, 2013
Fujipoly’s Zebra® Gold Series 8000B is a high performance, low resistance connector that is capable of transferring both data and power between parallel components or circuit boards.This interconnect device is constructed from a low durometer silicone
Read MoreNew Form-in-Place Thermal Compound Offers Many Advantages
- Posted: 4 March, 2013
Fujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound.
Read MoreThermal Gel Sheets
- Posted: 29 January, 2013
Fujipoly announces the availability of Sarcon® 50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.
Read MoreHappy Holidays!
- Posted: 13 December, 2012
Seasons Greetings to you and your family from the entire Fujipoly team! We look forward to working with you in the new year!
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