GR100A
To request a sample of GR100A please email info@fujipoly.com or click here.
RECOMMENDED APPLICATION:
In areas where space between surface is uneven or
varies and where surface textures are a concern
regarding efficient thermal transfer, the supple
consistency of Gap Filler Pad is excellent for filling air
gaps and uneven surfaces.
FEATURES:
• Highly Conformable and High Heat Conducting Gel materials
• SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form.
• Easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas.
CONSTRUCTION
| Series | Characteristics | Construction | ||||||||||||||||||||||
| SARCON GR100A-00 | Silicone compound with double sticky surfaces and Thermal Conductivity of GR100A material is 10.0W/m-K by using Hot Disk. |  |
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| SARCON GR100A-0H | Silicone compound as above GR100A-00 plus additional hardening of the top surface to facilitate handling and installation during complex assemblies. | |||||||||||||||||||||||
TYPICAL PROPERTIES
| Properties | unit | GR100A-00 | Test method | Specimen | ||||||||||||||||||||
| Physical Properties |
Color | - | Pink | Visual | - | |||||||||||||||||||
| Specific Gravity | - | 3.2 | ASTM D792 | A | ||||||||||||||||||||
| Hardness Highest Value |
Shore OO | 50 | ASTM D2240 | B | ||||||||||||||||||||
| ASKER-C | 30 | JIS K7312 | ||||||||||||||||||||||
| Electrical Properties |
Volume Resistivity | Ohm-m | 3.0x1011 | ASTM D257 | C | |||||||||||||||||||
| Breakdown Voltage | kV/mm (volts/mil) | 10 | (254) | ASTM D149 | C | |||||||||||||||||||
| Dielectric Strength | kV/mm (volts/mil) | 9 | (229) | ASTM D149 | C | |||||||||||||||||||
| Dielectric Constant | - | 50Hz | 11.4 | ASTM D150 | A | |||||||||||||||||||
| 1kHz | 9.6 | |||||||||||||||||||||||
| 1MHz | 8.4 | |||||||||||||||||||||||
| Dissipation Factor | - | 50Hz | 0.372 | ASTM D150 | A | |||||||||||||||||||
| 1kHz | 0.070 | |||||||||||||||||||||||
| 1MHz | 0.024 | |||||||||||||||||||||||
| Thermal Properties |
Thermal Conductivity | W/m-K | 10.0 | by Hot Disk | ISO 22007-2 | D | ||||||||||||||||||
| Useful Temperature | ? (°F) | -40 to +150 (-40 to +302) | - | - | ||||||||||||||||||||
| Low molecular Siloxane | wt% | D3 to D10 | 0.0010 | Gas Chromatography | - | |||||||||||||||||||
| Flame Retardant | - | V-0 | UL 94 | - | ||||||||||||||||||||
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