Gap Filler Pads (Putty)

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The chart below contains link to all Putty products. Select a part to view details.

SARCON ^®	Type	Application Guidelines	Typical Thermal Conductivity
SARCON ^®	Type	Application Guidelines	Cal/cm - sec - °C	Watt/m•K
SARCON® PG25A	Putty	Lowest modulus, putty-like gap filler available	6.0 x 10^-3	2.50
SARCON ^® PG45A		Lowest modulus, putty-like gap filler available	-	4.50
SARCON ^® PG80B		High performance thermal conductivity gap filler pad	19.1 x 10^-3	8.00
SARCON ^® PG130A		Very high thermal conductivity putty	26.3 x 10^-3	13.00

SARCON® Silicone Putty is a highly conformable, thermally conductive, nonflammable interface materials. It’s thermal performance is equal to our most highly rated GR45A, GR80A and PG130A Silicone Gap Filler Pads.

Four formulations are available, PG25A, PG45A, PG80A and XR-PG130A. The specifications for each can be found in the chart below. The surface consistency is excellent for filling small air gaps and uneven mating surfaces, making reliable contact with various shapes and sizes of components.

Very low compression force at high compression rate
Suitable for gaps as small as 0.3mm or less
UL94 V-0 certified
Available in three formulations

UL FILE NUMBER: E58126

AVAILABLE CONFIGURATIONS:

Sheets
Die-cuts

APPLICATIONS:

Between chassis wall and heat sink
Between CPU and heat sink
Between semiconductor and heat sink
Component to heat spreader

Engineers in Action

Gap Filler Pads (Putty)

AVAILABLE CONFIGURATIONS:

APPLICATIONS:

CONSTRUCTION:

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