Ultra-Compressible Thermal Putty

Ultra-Compressible Thermal Putty

Sarcon® PG80A is an extremely compressible, high-performance thermal interface material. This advanced putty-like, gap filler pad exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13 W/m°K.  

Sarcon® PG80A requires very low compression force at high compression rates making it a great choice for applications that have delicate or wide-variation component heights requiring material compression between 30% and 90%. 

PG80A is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0mm) up to a maximum dimension of 300mm x 200mm. Sarcon® PG80A can also be ordered in die-cut form to fit almost any application shape and is well-suited for environments with operating temperatures ranging from -40 to +150°C.

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