Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves

Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of SARCON^® EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks.

SARCON^® EGR30A also provides excellent absorption effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 3.0 W/m°K (ASTM D 2326) and a thermal resistance of 1.65 K-cm²/W at 14.5 PSI. This highly versatile material is available in five sheet thicknesses (0.5, 1.0, 1.5, 2.0 and 2.5mm) up to a maximum dimension of 300mm x 200mm. SARCON^® EGR30A can also be ordered in die-cut form to fit almost any application shape. Fujipoly’s new material is well-suited for environments with operating temperatures that range from -40 to +120°C and exhibits a UL94 flame retardant rating of V-0.

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