Gel-Like Gap Filler Improves Cooling Performance
Sarcon® GR-Ae is an extremely versatile, gel-like consistency thermal interface material that can be die cut to fit almost any shape electronic component. This gap filler pad is available in multiple thicknesses ranging from 0.5mm to 5.0mm and can be ordered in full sheets up to 200 mm x 300 mm.
When sandwiched between heat-generating components and a heatsink, the extremely soft Sarcon® GR-Ae material gently fills air gaps that reduce the cooling performance of the heatsink. Once installed, this TIM delivers a thermal conductivity of 1.3 W/m•K with a thermal resistance as low as .50 °C•in2/W.