A New Thermal Interface Alternative
Fujipoly’s Sarcon® 25GR-T2d thermal interface material is a very soft, highly conformable gap filler pad with a reinforced mesh center. The unique physical characteristics of this product make it an ideal alternative to grease for applications that require a thermal interface bridge across larger surface areas. 25GR-T2d is also a great alternative to several thin films when it is not possible to exert a large amount of force between the heat spreader/housing/PCB and the heat sink.
When placed between a heat source such as a semiconductor and a nearby heat sink, this .25mm thick Sarcon® gap filler pad completely fills uneven surfaces and varying textures. Once installed, the TIM delivers a thermal conductivity of 1.5 W/m°K per ASTM D2326 and a thermal resistance of .40 °Cin2/W at 43.5 psi. In addition, the naturally tacky consistency of the material allows for fast and easy assembly without adhesive.
25GR-T2d is recommended for applications with operational temperatures between -40°C and +150°C and can be ordered in convenient 10 meter rolls or pre-cut sheets up to a maximum size of 200mm x 300mm.