New! Extremely Low Compression Force Thermal Putty
- May 24, 2021
- 1 min read
SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus thermal gap filler also helps reduce stress on the PCB during assembly.
Available in thicknesses from 1.5mm to 2.5mm, SARCON ® PG45A helps improve cooling performance by completely filling unwanted air gaps that exist between heat generating components and a nearby heatsink. Once installed, the material exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K.
PG45A is available in precut dimensions up to 300mm x 200mm or can be die-cut to fit almost any application shape. SARCON® PG45A is well-suited for environments with operating temperatures ranging from -40 to +150°C.
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