Reinforced Thermal Material for Die-Cutting
Fujipoly announces the availability of Sarcon® 100GR-FL, a low resistance and highly durable thermal interface gap filler pad. The unique gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. The true-to-form gap filler pad is easier to install and increases productivity compared to non-reinforced alternatives. When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, Sarcon® 100GR-FL will transfer heat with a thermal conductivity of 2.8W/m-K and a thermal resistance of .67°Cin2/W at 14.5 PSI. This 1.0mm thick, flame retardant TIM is available in sheets up to 300mm x 200mm.