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New High-Performance Thermal Interface Thin Film

New High-Performance Thermal Interface Thin Film

The introduction of Sarcon® YR?c by Fujipoly® gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W.

When placed between a heat source such as a high?performance semiconductor and a nearby heatsink, the Sarcon® YR?c effectively eliminates near?microscopic air gaps that exist between the components. By increasing surface area contact it is possible to measurably improve the cooling performance of the heatsink.

This V?0 rated thin film is recommended for applications with operational temperatures that range from ?40°C to +150°C. Sarcon® YR?c is available in thicknesses of 0.2, 0.3, and 0.45mm. It can be ordered in roll form up to 150mm wide or can be die?cut to your exact specification requirements.

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