New Gap Filler Transfers Heat and Absorbs Electromagnetic Waves

Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon® EGR-11F makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks.

Sarcon® EGR-11F also provides excellent shielding effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 1.0 W/m°K (ASTM D 2326) and a thermal resistance of 1.05°Cin2/W at 14.5 PSI. This highly versatile material is available in three sheet thicknesses (0.5, 1.0, 1.5mm) up to a maximum dimension of 300mm x 200mm. Sarcon® EGR-11F can also be ordered in die-cut form to fit almost any application shape. Fujipoly’s new material is well-suited for environments with operating temperatures that range from -30 to +120°C and exhibits a UL94 flame retardant rating of V-0.