5.0 W/m°K FIP Thermal Compound

SARCON® SPG-50A from Fujipoly® is among the industry's highest performance form-in-place gap filler compounds. The 5.0 W/m°K silicone based material is a great option for electronic devices that have delicate components or ultra-low compression force requirements.

The form stable SPG-50A material fills large gaps around fragile circuit board solder points without causing damage or loss in performance. This facilitates efficient transfer of heat from any board-level source to a nearby heat sink or heat spreader. Due to its unique composition, this thermal compound provides excellent vibration absorption capabilities and maintains all initial properties across a wide temperature range (-40C to + 150C). SARCON® SPG-50A is available in easy-to-use tubes or syringes.