Recent News

Easy to Apply Form-in-Place Thermal Gap Filler

New SiteSARCON® SPG-20A from Fujipoly® is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0 W/m°K and a thermal resistance of only 2.

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Design Guidelines

Fujipoly electronic packaging components provide the finest performance available. To assure expected long-term results, refer to the following simple guidelines for each product area.

Feel free to browse our design guidelines by choosing from one of the options below or from the left hand navigation.