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Easy to Apply Form-in-Place Thermal Gap Filler

New SiteSARCON® SPG-20A from Fujipoly® is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0 W/m°K and a thermal resistance of only 2.

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Easy to Apply Form-in-Place Thermal Gap Filler

New SiteSARCON® SPG-20A from Fujipoly® is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills unwanted gaps as small as 0.08mm. This allows for more efficient transfer and dissipation of heat from the component and improved performance.

Due to its superior handling properties, SPG-20A is an excellent alternative to thermal grease. The form-in-place silicone material requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C).