Recent News

Extremely Soft TIM Delivers 13 W/m°K Performance

New SiteSarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads.

The 13 W/m°K

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Company Announcements

Extremely Soft TIM Delivers 13 W/m°K Performance

New SiteSarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads.

The 13 W/m°K putty-like material requires very low compression force at high compression rates, allowing it to gently conform to most component shapes and uneven surfaces.

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Fujipoly’s Coolest Giveaway

New SiteJust click a link & name a Fujipoly® product and you could be the winner of the 2017 Stay Cool and Get Connected Giveaway. One lucky engineer will get the opportunity to select from three amazing gifts including a Samsung Gear Smart Watch, Nikon Coolpix B700 and $500 American Express gift card.

Due to the limited promotion of this giveaway, your chances of winning are very good.

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Form-in-Place TIM Fills Large Gap

SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. SPG-30B delivers a superior thermal conductivity of 3.1 W/m°K with a thermal resistance of only 0.33°Cin2/W.

The ultra-low compression force silicone compound completely fills all spaces, gaps and protrusions when compressed between a heat source and a nearby heat sink or spreader. The material is easy to apply and does not require heat curing.

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A Better Connection

The Zebra® 1002 Carbon Connector from Fujipoly® offers electronic device manufacturers an extremely affordable and reliable option for connecting printed circuit boards to a variety of LCD displays.

The unique layered construction of this interconnect device includes 240 alternating layers of conductive and non-conductive silicone per inch allowing it to accommodate contact pad spacing as close as .015” (0.38mm).

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New Benchmark for Thin Film Performance

Fujipoly’s SARCON® 30XR-Um Thin Film sets a new standard for performance and compressibility. The putty-like thermal gap filler pad exhibits a thermal conductivity of 17 watt/m-k and a thermal resistance of only 0.02 °Cin2/W.

The unique physical properties of this thermal interface material allow it to be compressed quickly using a very low compression force.

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