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New Gap Filler Pad Introduced

New SiteFujipoly announces the introduction of Sarcon® GR25A-00-50GY, an extremely soft thermal gap filler pad that also exhibits a very low thermal resistance.

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Thermally Conductive Thin Film

GR-FL Sarcon® 30HR from Fujipoly is a silicone-based thin film that exhibits a 1.7 W/m°K thermal conductivity when placed between a heat source such as a high-performance semiconductor and a nearby heatsink. This conformable thermal interface medium effectively eliminates air gaps that exist between components. The increased surface contact can measurably improve the cooling performance of a heatsink.

Sarcon® 30HR has a thermal resistance of .42 °Cin2/W and is recommended for applications with operational temperatures that range from -60°C to +180°C. The V-0 flame-retardant thin film is available in roll widths up to 85mm.