Posted: Friday May 24, 2013
Fujipoly announces the introduction of Sarcon® GR25A-00-50GY,
an extremely soft thermal gap filler pad that also exhibits a very low thermal
resistance.
Sarcon® 30HR from Fujipoly is a silicone-based
thin film that exhibits a 1.7 W/m°K thermal conductivity when placed between a heat
source such as a high-performance semiconductor and a nearby heatsink. This conformable
thermal interface medium effectively eliminates air gaps that exist between
components. The increased surface contact can measurably improve the cooling
performance of a heatsink.
Sarcon® 30HR has a thermal
resistance of .42 °Cin2/W and is recommended for applications with
operational temperatures that range from -60°C to +180°C. The V-0
flame-retardant thin film is available in roll widths up to 85mm.