Recent News
New Gap Filler Pad Introduced
Posted: Friday May 24, 2013
Fujipoly announces the introduction of Sarcon® GR25A-00-50GY,
an extremely soft thermal gap filler pad that also exhibits a very low thermal
resistance.
Company Announcements
Fujipoly Gets Social
Posted: Wednesday January 11, 2012
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Today Fujipoly America announced the launch of a You Tube channel that will provide engineers with 24/7 access to useful technical information on Thermal Interface Materials and Elastomeric Connectors. The company’s first video post includes a demonstration on how to properly select a thermal gap filler material for your specific application.
In Need of More Support?
Posted: Monday November 28, 2011
Fujipoly’s Zebra® 1002 Elastomeric Connector, offered with silicone rubber supports, make it possible for engineers to make a reliable electrical connection between a printed circuit board and an LCD display without the need to incorporate an additional holder.
ELD Connectors for Modern Avionics
Posted: Monday October 31, 2011
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Since the introduction of the “glass cockpit”, commercial and military aircraft manufacturers have experienced significant demand for next-generation technology. In place of mechanical, analog and digital gauges, pilots now enjoy a fully integrated navigation, communications and aircraft systems suite that presents information on easy-to-read liquid crystal (LCD) and electroluminescent (ELD) displays.
One element that is critical to most ELD-style instruments is the electronic packaging component that creates the connection between the printed circuit board and the electroluminescent display. Fujipoly’s <
Easy Get Away
Posted: Wednesday September 28, 2011
An important consideration among electronics manufacturers is the damage that can be done to a thermal gap filler pad during delicate assembly and re-work operations. To help alleviate this problem, Fujipoly announces the availability of Sarcon® 50G-Hm. This high performance, low resistance gap filler pad is manufactured with a special low-tac top surface.
The unique, one-sided treatment is less sticky than the opposing surface allowing the thermal pad to adhere to either the target electrical component or opposing heat sink.
Level Playing Field
Posted: Wednesday August 24, 2011
The worldwide appetite for advanced technology is growing at a record pace. In order to stay ahead of this demand curve, electronics manufacturers are looking for new opportunities to integrate emerging technologies on the same board. Today, it is common practice to incorporate multi-band communications, GPS, video and high-speed processors within a very small device footprint.